Senior Research Engineer/Research Engineer Wafer Level Package Assembly
Job Number:
4007682
Date Posted:
07/13/2010
Job Description
Job Responsibilities:
To develop wafer level packaging and embedded packaging for electronic devices, with emphasis on pick& place, flip-chip assembly, wafer thinning and dicing
Job Requirements:
Masters degree/PhD in Mechanical Engineering or Material Science
Experience in Flip-chip assembly, wafer thinning and dicing
Experience in wafer level molding and mold material characterization
Excellent communication skills and teamwork with strong self-motivation
Contact:
Chan Soke Yee
Institute of Microelectronics (IME) 11 Science Park Road Singapore Science Park II Singapore, Singapore 117685 Singapore Phone: 65-67705351 Fax: 65-67731912 Email: personnelime.a-star.edu.sg
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ime.a-star.edu.sg
